Advertisementspot_img
Sunday, December 22, 2024

Delivering Stories of Progress

Advertisementspot_img

BOI greenlights ₱125-M investment of steel frame modules producer in PH

Latest article

Advertisement - PS02barkero developers premium website

THEPHILBIZNEWS Partner Hotels

Hotel Okura Manila
Hotel 101
The Manor at Camp John Hay
Novotel Manila
Taal Vista Hotel
Advertisement - PS02barkero developers premium website

The Board of Investments (BOI) has approved the application for registration of Accutech Steel and Service Center, Inc. (ASSCI) as a new producer of Steel Frame Modules for Structural Building Systems in the Philippines.

Soon to operate in Taguig City, this is the first project approved under Tier III of the Strategic Investment Priority Plan (SIPP) since it falls under “Highly Technical Manufacturing and Production of Innovative Products”.

With an investment of Php125 million, the project introduces a new production line dedicated to designing and manufacturing Steel Frame Modules or Panels from slit rolls of galvanized Cold Form Steel (CFS), commonly referred to as Light Gauge Steel (LGS). Accutech’s project stands out as highly technical, utilizing computer-aided and controlled processes for project management, structural design, and engineering. The steel frame modules are intended for Structural Building System applications, including for houses, mid-rise buildings, factory warehouses, and a variety of other residential, commercial, industrial, utility, artistic, and architectural structures.

DTI Undersecretary Ceferino S. Rodolfo, BOI’s Managing Head, highlighted the project’s innovation, noting that the use of CFS/LGS framing for structural building systems is a relatively new technology for the Philippine construction industry. Advanced countries like the US, Australia, and New Zealand have already adopted CFS/LGS frames for structural building construction due to their economical, eco-friendly, and rapid construction benefits.

“We are forging ahead with groundbreaking investment opportunities in the Philippines. This project heralds a revolutionary chapter in our construction industry, showcasing cutting-edge innovations. The green light for this endeavor underscores our relentless dedication to driving the construction sector’s growth and dynamism,” emphasized Trade Secretary and BOI Chairman Alfredo E. Pascual.

ASSCI’s initiative is poised to transform the construction industry towards a more economical, faster, sustainable, and smarter construction method for houses and buildings and aims to revolutionize the construction industry by offering sustainable and efficient solutions that meet the stringent requirements of modern architectural and engineering standards.

The Department of Science and Technology (DOST) – Research and Development, endorsed the Tier III project. ASSCI’s initiative represents the commercial implementation of one of DOST’s Collaborative Research and Development to Leverage the Philippine Economy (CRADLE) program, known as Smart Manufacturing for Rapid Technology (SMART) in Housing Construction.

In collaboration with De La Salle University – Manila as the implementing organization and ASSCI as the industry partner, the SMART program aims to develop an innovative CFS-based structure system, incorporating Screw Piles and utilizing Design for Manufacturing and Assembly (DFMA) technology.

Title III of the SIPP covers research & development (R&D) and activities adopting advanced digital production technologies of the fourth industrial revolution, such as but not limited to, robotics, artificial intelligence (AI), additive manufacturing, data analytics, digital transformative technologies, and other Industry 4.0 technologies.

In addition, the tier covers highly technical manufacturing and production of innovative products and services such as but not limited to the manufacture of equipment, parts & services; commercialization of intellectual property (IP) and R&D products/services; aerospace, medical devices (except personal protective equipment); internet of things (IoT) devices and systems (includes wireless sensors and devices); full-scale wafer fabrication; and advanced materials.

Advertisement - PS04spot_img

More articles

LEAVE A REPLY

Please enter your comment!
Please enter your name here

Advertisement - PS05spot_img
Advertisement - PS01spot_img

Must read

Advertisement - PS03spot_img